Investigation of material removal mechanisms of laser-structured Si3N4 via single diamond grit scratching

Abstract Grinding hard-brittle materials like silicon nitride is faced with some challenges, including sub-surface damage, high tool wear, and low grinding efficiency. Ultrashort-pulse laser structuring of hard prior to the process significantly reduces cutting forces temperature increases achievable material removal rate process. These effects are partially due controllable induced damages into subsurface structured workpieces. However, impacts this surface technique on mechanism advanced ceramics, such as Si 3 N 4 , not yet thoroughly investigated. The dominant in brittle materials, (Si ), defines integrity workpiece. For first time, in-depth single diamond grit scratching experiments carried out investigate changes mechanisms at various chip thicknesses by . Two different ratios (25% 50%) were generated sample surfaces a femtosecond laser. mechanism, pile-up area, area width groove, path, normal tangential forces, specific energy have been results indicate that considerably affects reduction depth ratio, (up 89%) 82%) energy. laser-structured workpieces converged about 5 J/mm much lower than unstructured